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New Bonds in Shanghai & Shenzhen

Update of new issued bonds listed in China’s Shanghai Stock Exchange and Shenzhen Stock Exchange.

China Huaneng Group Co.,Ltd. issued corporate bond on 2024/3/26 in Shanghai Stock Exchange. Interest commencement date is 2024/3/26. Maturity date is 2034/3/26. Coupon rate is 2.90 %. Local code is 240812. Issue amount is CNY 1.0 bn. The issue of this bond is for professional investors. Maturity date is extendible.

China North Industries Group Corporation Limited issued corporate bond on 2024/3/26 in Shanghai Stock Exchange. Interest commencement date is 2024/3/27. Maturity date is 2029/3/27. Coupon rate is 2.61 %. Local code is 240803. Issue amount is CNY 2.5 bn. The issue of this bond is for professional investors. This is a bond for technological innovation companies.

China Securities Co.,Ltd. issued corporate bond on 2024/3/26 in Shanghai Stock Exchange. Interest commencement date is 2024/3/27. Maturity date is 2034/3/27. Coupon rate is 2.78 %. Local code is 240770. Issue amount is CNY 1.0 bn. The issue of this bond is for professional investors. This is Tranche B.

Guangzhou Industry Investment Holdings Group Co.,Ltd. issued corporate bond on 2024/3/26 in Shanghai Stock Exchange. Interest commencement date is 2024/3/27. Maturity date is 2029/3/27. Coupon rate is 2.75 %. Local code is 240821. Issue amount is CNY 1.05 bn. The issue of this bond is for professional investors.Login or apply for membership to read more, Apply for membership here

Source: Shanghai Stock Exchange, Shenzhen Stock Exchange.

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