Update of new issued bonds in China’s Shanghai Stock Exchange and Shenzhen Stock Exchange.
Beijing Capital Group Co.,Ltd. issued corporate bond on 2024/2/23 in Shanghai Stock Exchange. Interest commencement date is 2024/2/26. Maturity date is 2027/2/26. Coupon rate is 2.69 %. Local code is 240590. Issue amount is CNY 2.0 bn. The issue of this bond is for professional investors. This is a bond for technological innovation companies.
Beijing Urban Construction Group Co.,Ltd. issued corporate bond on 2024/2/23 in Shanghai Stock Exchange. Interest commencement date is 2024/2/26. Maturity date is 2026/2/26. Coupon rate is 2.65 %. Local code is 240607. Issue amount is CNY 2.0 bn. The issue of this bond is for professional investors. Maturity date is extendible.
CCCC Construction Group Co.,Ltd. issued corporate bond on 2024/2/23 in Shanghai Stock Exchange. Interest commencement date is 2024/2/26. Maturity date is 2029/2/26. Coupon rate is 3.00 %. Local code is 240615. Issue amount is CNY 300.0 mn. The issue of this bond is for professional investors. Maturity date is extendible. This is Tranche B.Login or apply for membership to read more, Apply for membership here
Source: Shanghai Stock Exchange, Shenzhen Stock Exchange.